SOLDER PASTE
Solder paste is a high-performance alloy-based adhesive used in Surface Mount Technology (SMT) and Through-Hole Technology (THT) assembly processes. It consists of finely powdered solder alloy particles suspended in flux, ensuring a strong and reliable bond between electronic components and printed circuit boards (PCBs).
ABTEKTRON offers lead-free and leaded solder pastes, designed for high-precision applications in the electronics manufacturing industry. Our solder pastes provide excellent printability, long stencil life, and superior wetting performance, ensuring high-yield and defect-free soldering.
Product Features
- Superior Printability – Ensures precise stencil printing with consistent deposits.
- Excellent Wettability – Provides strong, reliable solder joints with minimal defects.
- Long Stencil Life – Extended open time without drying, ensuring smooth printing.
- Anti-Slumping Formula – Prevents paste spreading and ensures sharp printing definition.
- Low Voiding & Strong Adhesion – Reduces solder voids and improves mechanical strength.
- Compatibility with Various Alloys – Available in Sn63/Pb37, SAC305, and SnAgCu formulations.
- Halogen-Free & Environmentally Friendly Options – Compliant with RoHS and REACH standards.
Product Applications
- Surface Mount Technology (SMT) – PCB assembly for consumer and industrial electronics.
- Automotive Electronics – High-reliability circuits for vehicles and EVs.
- Medical Devices – PCBs for healthcare and diagnostic equipment.
- LED & Display Manufacturing – Ensures strong connections for LED chip bonding.
- Aerospace & Defense – High-precision soldering for mission-critical components.